Printed circuit boards are essential components integrated into smartphones, cars, and even games that are part of our daily lives.
These circuit boards contain intricate electronic circuits and components, protected by green or black insulating films to shield them from dust and heat.
When it comes to such insulating films, you're probably familiar with "solder resist (SR)" from "Taiyo Holdings Co., Ltd." (hereinafter, Taiyo Holdings).
Taiyo Holdings held its "Electronics Business Strategy Presentation 2025" on Tuesday, May 20, 2025!
During the presentation, the new next-generation heat dissipation paste material "HSP-10 HC3W" was announced for Taiyo Holdings' electronics business!
"Electronics Business Strategy Presentation 2025" Held!
Taiyo Holdings announced "HSP-10 HC3W," a next-generation heat dissipation paste material for automotive power semiconductors.
At the Electronics Business Strategy Presentation 2025, Shoji Minegishi, Senior Managing Executive Officer, CTO of the Electronics Company, and President of Taiyo Ink Mfg. Co., Ltd., along with Hidekazu Miyabe, Director and Head of the Technology Development Center at Taiyo Ink Mfg. Co., Ltd., spoke about the current status of the electronics business and the new product "HSP-10 HC3W."
Taiyo Holdings Co., Ltd. is the World's No. 1 Solder Resist Manufacturer!
Taiyo Holdings, founded in 1953, is celebrating its 72nd anniversary in 2025.
Out of its three core businesses—Electronics, Medical and Pharmaceuticals, and ICT and Sustainability—this presentation focused on the electronics business strategy.
Taiyo Holdings' electronics business includes Taiyo Ink Mfg. Co., Ltd. in Japan, as well as manufacturing and sales subsidiaries overseas.
The sales of the electronics business have been steadily increasing in recent years, doubling compared to 2015, ten years ago.
In the market, China, South Korea, and Taiwan account for the majority of sales.
- China: 96%
- South Korea: 18%
- Taiwan: 10%
- Others: 9%
- Japan: 4%
Taiyo Holdings Co., Ltd. is known as the world's No. 1 manufacturer of solder resist (SR), which covers printed circuit boards.
The main products' sales composition is for general-purpose and high-performance rigid boards.
Domestically, they have bases in Saitama and Fukuoka, and overseas, they have bases in China, Taiwan, and other locations.
Additionally, in April 2024, they established "InnoValley" as a technology development center, where they are promoting the development of new technologies and application expansion, in addition to solder resist.
It was at this "InnoValley" technology development center that the next-generation heat dissipation paste material "HSP-10 HC3W" was developed.
Next-Generation Heat Dissipation Paste Material "HSP-10 HC3W" Announced! Solving Heat Dissipation Issues
"HSP-10 HC3W" was adopted by a major automotive parts manufacturer for their in-car charger converter and launched in February of this year.
In the growth strategy of the electronics business, "HSP-10 HC3W" is categorized as a product created with new technology, not conventional technology.
In recent years, as various electronic products have become more high-performance, there has been an increase in components that handle large amounts of information by flowing large currents.
At that time, as a "thermal design issue for power semiconductors," there has been an increase in cases where large currents are passed through small housings and fine wiring, inevitably leading to heat generation.
We developed the next-generation heat dissipation paste material "HSP-10 HC3W" to address the significant challenge of how to dissipate this heat in the future.
(Translated from Japanese)
The background of the development of "HSP-10 HC3W" involved the challenge of heat dissipation issues in printed circuit boards.
Conventional printed circuit boards have a structure where heat from power semiconductors is dissipated through a heatsink, and a TIM material is applied between the power semiconductor and the heatsink to facilitate heat dissipation.
The problem with conventional TIM materials was that they could degrade due to heat from the power semiconductor or develop gaps between them and the heatsink, leading to inefficient heat release.
To solve this problem, Taiyo Ink Mfg. Co., Ltd. not only advocated for dissipating heat upwards through the heatsink but also for dissipating it downwards through the printed circuit board.
The challenge with dissipating heat downwards was the need for a TIM material with insulating properties that would adhere to the solder resist applied to the printed circuit board.
"HSP-10 HC3W," announced this time, is a TIM material that combines both heat dissipation and insulating properties.
"HSP-10 HC3W" Features
- Solvent-free
- Thermosetting resin
- High dielectric breakdown voltage
Among the features of "HSP-10 HC3W" are its high insulation properties, utilizing Taiyo Holdings' solder resist technology, and its adoption of a solvent-free formula to achieve surface smoothness.
For the resin, they switched to a thermosetting resin that is resistant to heat, and conducted environmental tests for 1,000 cycles at -40°C to 165°C, resulting in no cracking or peeling and maintenance of various properties.
It ensures heat dissipation and insulation while enhancing long-term mechanical strength.
Full-scale mass production of "HSP-10 HC3W" is scheduled to begin in January 2026.
Taiyo Holdings states that, starting with this product, as the world's No. 1 solder resist manufacturer, they will pioneer the future of Japanese manufacturing with advanced products and business development originating from "InnoValley."
